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반도체 패키지와 테스트의 입문서다. 제1장에서는 테스트 장비와 프로세스, 대략적인 테스트 항목에 대해 설명하였고, 제2장에서는 패키지의 정의와 역할, 기술 개발 트렌드, 기술 개발 프로세스 등을 설명하였다. 제3장에서는 패키지의 종류를 분류하고, 각 종류별 특징, 장단점 등을 기술하였다.

제4장에서는 패키지 설계와 해석을 설명하였고, 제5장은 패키지 공정을 설명하였다. 제6장에서는 패키지 공정 진행을 위해서 사용되는 재료들을 소개하였고, 제7장에서는 품질과 신뢰성의 의미 및 신뢰성 평가 항목들의 진행 방법과 목적을 설명하였다.

01 반도체 테스트의 이해

01.  반도체 후공정 ······················································ 5
02.  테스트의 종류······················································ 8
03.  웨이퍼 테스트 ···················································· 10
EPM ································································ 13
웨이퍼 번인······················································· 13
테스트 ····························································· 14
리페어······························································ 15
04.  패키지 테스트 ···················································· 16
TDBI································································ 17
테스트 ····························································· 18
외관 검사·························································· 18

02 반도체 패키지의 정의와 역할

01.  반도체 패키지의 정의········································· 25
02.  반도체 패키지의 역할 ········································ 26
03.  반도체 패키지의 개발 트렌드····························· 28
04.  반도체 패키지 개발 과정 ··································· 31

최근작 :<반도체의 부가가치를 올리는 패키지와 테스트> … 총 3종 (모두보기)


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